ATS-X53170B-C1-R0

When it comes to optimal thermal management in electronics, selecting the right heatsink can make all the difference. Introducing the ATS-X53170B-C1-R0, an extruded heatsink specifically designed to enhance heat dissipation capabilities for various electronic components.

Product Overview

The ATS-X53170B-C1-R0 is a high-performance heatsink featuring a sleek blue finish that not only looks great but serves a crucial function. With dimensions of 17mm in length, 17mm in width, and 7.5mm in height, this heatsink fits comfortably on various components, including Ball Grid Array (BGA) devices, making it a versatile choice for designers and engineers alike.

Key Features

• Material: Extruded Aluminum – Known for excellent thermal conductivity.
• Design: Grill Structure – Provides added surface area for heat dissipation.
• Compatibility: Ideal for BGA applications, ensuring efficient cooling.
• Color: Blue – A modern finish that integrates well with various designs.
• Compact Size: Dimensions of L: 17mm, W: 17mm, H: 7.5mm, suitable for confined spaces.

Why Choose the ATS-X53170B-C1-R0?

Choosing the right heatsink is vital for extending the lifespan and performance of your electronic devices. The ATS-X53170B-C1-R0 stands out for several key reasons:

Efficient Heat Dissipation

The extruded design of the ATS-X53170B-C1-R0 allows for significant surface area exposure to ambient air, promoting efficient heat transfer. The grill pattern maximizes air circulation around the heatsink, enhancing its thermal performance.

Robust Construction

Constructed from high-quality aluminum, the ATS-X53170B-C1-R0 is lightweight yet exceptionally robust, ensuring it withstands high temperatures while maintaining its structural integrity over time.

Versatile Applications

Whether designing a custom circuit board or upgrading an existing system, the compact size of the ATS-X53170B-C1-R0 makes it perfect for a wide array of applications, including:

• Computers and Laptops
• Telecommunications Equipment
• Gaming Consoles
• LED Lighting Systems
• Automotive Electronics

Installation Guide

Installing the ATS-X53170B-C1-R0 heatsink is straightforward, allowing you to focus on your project without complicated installation processes. Here’s a simple step-by-step guide:

1. Clean the Surface: Ensure the component surface is clean to promote optimal adhesion.
2. Apply Thermal Interface Material: It’s recommended to apply thermal paste or pad to enhance thermal transfer.
3. Position the Heatsink: Align the ATS-X53170B-C1-R0 over the component accurately.
4. Secure the Heatsink: Depending on your application, use clips or screws to secure the heatsink in place.

Maintenance Tips

To ensure your ATS-X53170B-C1-R0 operates efficiently over time, consider these maintenance tips:

• Periodically check for dust accumulation and clean the heatsink as needed.
• Inspect the thermal interface material to ensure it remains effective.
• Monitor the performance of the electronic components to validate that the heatsink is providing adequate cooling.

Technical Specifications

For a quick overview, here are the technical specifications of the ATS-X53170B-C1-R0:

• Material: Extruded Aluminum
• Finish: Blue
• Dimensions:
  • Length: 17mm
  • Width: 17mm
  • Height: 7.5mm
• Application: Suitable for BGA

Conclusion

The ATS-X53170B-C1-R0 is an essential addition for anyone looking to improve the thermal performance of their electronic devices. With its compact design and effective heat dissipation capabilities, it is the go-to choice for engineers, designers, and hobbyists. Don’t compromise on your thermal management solutions; choose the ATS-X53170B-C1-R0 for reliability and efficiency today!

Discover more options and enhance your thermal management solutions by visiting our heatsink category page!