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ATS-X50375P-C1-R0

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This blue extruded heatsink features a grilled design suitable for BGA applications, measuring 37.5mm in length and width. With a thermal resistance of 2.1°C/W, it effectively dissipates heat, ensuring optimal performance for electronic components.

SKU: 298942093232 Category:
Weight:
25.4g

$27.22

/

pcs

25 in stock

Estimated delivery time: 7-14 days
* Please note that delivery times may vary based on supplier availability and shipping location.

Quantity FromPrice Per Item
1$22.68
2$21.44
25$21.08
50$20.52

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Packing Information:
  • Packing Detail: CT1, ST, , 25
Description

When it comes to efficient thermal management in electronic devices, the ATS-X50375P-C1-R0 is a top-of-the-line heatsink designed to deliver exceptional performance. Whether you are an engineer, DIY enthusiast, or simply seeking a reliable cooling solution, understanding the specifications and features of the ATS-X50375P-C1-R0 can help you make an informed decision.

Key Specifications of the ATS-X50375P-C1-R0

The ATS-X50375P-C1-R0 heatsink stands out for its robust construction and specially engineered design aimed at maximizing thermal dissipation. Here are the key specifications that make this product a standout in the market:

  • Material: Extruded aluminum, known for its lightweight and durability.
  • Design: Grilled structure to optimize airflow and heat dissipation.
  • Compatibility: Suitable for BGA (Ball Grid Array) chip configurations.
  • Dimensions: The heatsink measures 37.5mm in both length and width, making it compact yet efficient.
  • Thermal Resistance: Offers a thermal resistance rating of 2.1°C/W, ensuring effective cooling performance.

The Importance of a Quality Heatsink

In any electronic application, managing heat is crucial for maintaining optimal performance and prolonging the lifespan of components. The ATS-X50375P-C1-R0 heatsink plays an essential role in this process.

High temperatures can lead to thermal throttling, where processors slow down to prevent overheating, resulting in inefficient performance. A quality heatsink like the ATS-X50375P-C1-R0 mitigates this risk by effectively dissipating heat away from critical components, allowing them to operate at their full potential.

Design Features of the ATS-X50375P-C1-R0

Extruded Aluminum Construction

Constructed from high-quality extruded aluminum, the ATS-X50375P-C1-R0 offers a combination of strength and lightweight properties. This not only ensures durability but also makes installation easy without adding significant weight to your project.

Grilled Design for Enhanced Airflow

The grilled structure of the heatsink is specifically designed to improve air circulation around the dissipating surface. This feature is particularly important in applications where heat buildup can compromise performance.

BGA Compatibility

With its design tailored for BGA configurations, the ATS-X50375P-C1-R0 heatsink is perfect for modern electronic devices, such as graphics cards and CPUs. This compatibility ensures that it can be used in a variety of applications, providing versatile solutions for thermal management.

Why Choose the ATS-X50375P-C1-R0 Heatsink?

Choosing the right heatsink can significantly impact the success of your electronic projects. Here are a few reasons why the ATS-X50375P-C1-R0 should be your go-to choice:

  • Performance: With a thermal resistance of only 2.1°C/W, this heatsink ensures that your components stay cool even under heavy loads.
  • Ease of Installation: The compact size (37.5mm x 37.5mm) allows for easy integration into various setups without requiring significant space.
  • Durability: Made from high-quality materials, the ATS-X50375P-C1-R0 is built to last, making it a reliable choice for any electronics project.
  • Cost-Effective: Longevity and performance make this heatsink a cost-effective solution, reducing the need for frequent replacements or additional cooling systems.

Applications of the ATS-X50375P-C1-R0

The ATS-X50375P-C1-R0 heatsink is suitable for a wide range of applications, including but not limited to:

  • Consumer electronics
  • Gaming systems
  • Embedded and industrial control systems
  • Telecommunications devices

How to Maximize the Performance of Your Heatsink

To get the most out of your ATS-X50375P-C1-R0 heatsink, consider the following tips:

  • Proper Placement: Ensure that the heatsink is mounted securely and appropriately to maximize contact with the component it is cooling.
  • Use Thermal Paste: Applying thermal paste can help improve thermal conductivity between the component and the heatsink.
  • Ventilation: Make sure that your setup is well-ventilated to facilitate airflow around the heatsink.

Conclusion

In summary, the ATS-X50375P-C1-R0 heatsink provides excellent thermal management solutions for a variety of electronic applications. With its robust design, compact size, and superb performance capabilities, it is an ideal choice for engineers and enthusiasts alike. Ensure that you take full advantage of its features to keep your devices running efficiently and reliably.

If you are in the market for a high-quality performance heatsink, look no further than the ATS-X50375P-C1-R0. Invest in reliable cooling solutions for your electronic devices today! For more heatsinking options, check out our heatsinks category.

Additional information
Weight 0.0254 kg
Manufacturer

Type-of-heatsink

Heatsink-shape

Application

Colour

Length

Width

Height

Material

Material-finishing

Thermal-resistance-200-lfm

Manufacturer-series

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Shipping & Delivery

At Eselcom, we are committed to ensuring your orders are delivered with speed, security, and convenience. Our comprehensive shipping services are designed to provide peace of mind and reliability every step of the way.

  • Fast and Flexible Options: We offer various shipping speeds to accommodate your schedule, including express delivery for time-sensitive orders.
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  • Global Reach: With trusted logistics partners, we deliver to customers worldwide, making sure your components arrive safely and on time.
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