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ATS-55310R-C1-R0

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This heat sink features an extruded, grilled design suitable for BGA applications. It measures 31mm in length and width, with a height of 19.5mm. Finished in black, it effectively dissipates heat, ensuring optimal performance for electronic components.

SKU: 298941878382 Category:
Weight:
14.66g

13,26 

/

pcs

1 in stock

Estimated delivery time: 7-14 days
* Please note that delivery times may vary based on supplier availability and shipping location.

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Description

Introducing the ATS-55310R-C1-R0, an exceptional heatsink specifically engineered to meet the demands of modern electronic components. With its unique extruded, grilled design, this heatsink ensures efficient heat dissipation, making it a vital addition to your cooling solutions for various applications such as BGA (Ball Grid Array) packages.

Product Overview

The ATS-55310R-C1-R0 heatsink distinguishes itself in the market due to its high-quality construction and practical dimensions. Measuring 31mm in length, 31mm in width, and 19.5mm in height, this heatsink is designed to deliver optimal thermal performance without occupying excessive space. It is perfectly suitable for compact electronic designs, ensuring effective cooling while maintaining the overall footprint of your application.

Key Features

With the ATS-55310R-C1-R0, customers enjoy an array of impressive features:

  • Material Construction: Crafted from high-quality aluminum, the heatsink is both lightweight and durable. Aluminum’s excellent thermal conductivity ensures that heat is effectively transferred away from sensitive components.
  • Extruded and Grilled Design: The innovative design of the heatsink facilitates maximum airflow. Its grilled structure not only promotes air passage but also guarantees efficient heat dissipation, reducing the risk of overheating.
  • Compact Dimensions: With dimensions of L: 31mm, W: 31mm, and H: 19.5mm, the ATS-55310R-C1-R0 is designed for versatility. It fits easily into tight spaces in enclosures, making it ideal for various electronic and industrial applications.
  • Suitable for BGA Applications: Specifically engineered for BGA components, this heatsink effectively manages the thermal requirements of complex circuit boards, ensuring long-lasting performance and reliability.
  • Black Finish: The sleek black finish not only enhances the aesthetic appeal of your project but also contributes to thermal properties by efficiently absorbing heat.

Benefits of Using the ATS-55310R-C1-R0 Heatsink

Integrating the ATS-55310R-C1-R0 into your electronic designs yields numerous advantages:

  • Improved Thermal Management: Effective heat dissipation is critical for maintaining the integrity of electronic components. This heatsink plays a vital role in preventing thermal throttling and ensuring devices operate within optimal temperature ranges.
  • Increased Reliability: Utilizing the ATS-55310R-C1-R0 contributes to the overall longevity and reliability of your electronic components. Heat is a primary cause of component failure, and this heatsink mitigates that risk.
  • Enhanced Performance: Many electronic devices experience performance degradation at elevated temperatures. The ATS-55310R-C1-R0 helps maintain lower operating temperatures, facilitating peak performance in critical applications.
  • Versatile Applications: Whether you are designing consumer electronics, automotive systems, or industrial control systems, the versatility of the ATS-55310R-C1-R0 heatsink makes it suitable for a wide range of applications.

Installation and Compatibility

One of the standout features of the ATS-55310R-C1-R0 is its ease of installation. The heatsink is compatible with various mounting methods, making it adaptable to different circuit board designs. Whether you use thermal adhesive, screws, or clips, integrating this heatsink into your configuration is straightforward and efficient.

Installation Tips:

  • Ensure a clean surface on the component where the heatsink will be mounted for optimal thermal transfer.
  • Apply a thin layer of thermal paste to enhance heat conduction between the chip and heatsink.
  • Follow manufacturer guidelines for mounting techniques to avoid potential damage to components.

Conclusion

In summary, the ATS-55310R-C1-R0 represents a reliable and efficient solution for thermal management in today’s compact electronic environments. With its exceptional design, durability, and versatility, this heatsink addresses the thermal challenges faced by modern electronics. Whether you are an engineer seeking reliable cooling solutions or a hobbyist working on your next project, the ATS-55310R-C1-R0 heatsink is an essential component that guarantees performance and reliability. Discover more about our heatsinks and elevate your system’s thermal management today with the outstanding capabilities of the ATS-55310R-C1-R0 heatsink.

Additional information
Weight 0,01466 kg
Manufacturer

Length

Width

Height

Material

Colour

Application

Heatsink-shape

Type-of-heatsink

Thermal-resistance-200-lfm

Material-finishing

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Shipping & Delivery

At Eselcom, we are committed to ensuring your orders are delivered with speed, security, and convenience. Our comprehensive shipping services are designed to provide peace of mind and reliability every step of the way.

  • Fast and Flexible Options: We offer various shipping speeds to accommodate your schedule, including express delivery for time-sensitive orders.
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  • Global Reach: With trusted logistics partners, we deliver to customers worldwide, making sure your components arrive safely and on time.
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