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ATS-55300W-C1-R0

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This black extruded heatsink is designed for BGA applications, measuring 30mm in length, 30mm in width, and 24.5mm in height. Its grilled structure enhances airflow, making it an efficient choice for effective heat dissipation in compact electronic setups.

SKU: 298941861512 Category:
Weight:
17.45g

15,05 

/

pcs

87 in stock

Estimated delivery time: 7-14 days
* Please note that delivery times may vary based on supplier availability and shipping location.

Quantity FromPrice Per Item
1$12.54
2$11.56
4$10.93
5$10.92
25$10.60

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87 in stock

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Packing Information:
  • Packing Detail: TR1, ST, , 72
Description

As technology advances, the need for efficient cooling solutions becomes increasingly crucial in maintaining optimal performance for various electronic devices. The ATS-55300W-C1-R0 heatsink is meticulously designed to provide effective thermal management for a wide range of applications. With its unique design and exceptional quality, this heatsink is the perfect solution for anyone seeking to enhance their devices’ heat dissipation capabilities.

Key Features of the ATS-55300W-C1-R0 Heatsink

The ATS-55300W-C1-R0 heatsink offers a combination of dimensions, materials, and design, making it an ideal choice for effective heat dissipation. Below are some of its notable features:

  • Dimensions: With a length of 30mm, a width of 30mm, and a height of 24.5mm, the ATS-55300W-C1-R0 heatsink provides an optimal fit for BGA designs, ensuring maximum contact with the heat source.
  • Material: The heatsink is made from high-quality, extruded aluminum, which delivers remarkable thermal conductivity and durability.
  • Color: The sleek black finish not only adds aesthetic appeal but also enhances heat dissipation.
  • Design: The grilled structure of the ATS-55300W-C1-R0 ensures greater surface area exposure. This design promotes efficient airflow, significantly improving heat transfer away from sensitive components.

Benefits of Using the ATS-55300W-C1-R0 Heatsink

Choosing the right heatsink is essential for any electronic application where heat buildup may impact performance. The benefits provided by the ATS-55300W-C1-R0 heatsink include:

  • Improved Thermal Performance: The efficient design of the ATS-55300W-C1-R0 allows it to effectively dissipate heat, maintaining the optimal operating temperature of your devices.
  • Reliable Operation: Prevent overheating and ensure the longevity of your components with the reliable thermal management provided by this heatsink.
  • Easy Installation: The compact dimensions make it easy to incorporate the ATS-55300W-C1-R0 into your existing setups without occupying excessive space.
  • Versatility: Designed for BGA applications, the ATS-55300W-C1-R0 is suitable for a wide variety of electronic devices, from computing to telecom and beyond.

Applications of the ATS-55300W-C1-R0 Heatsink

This heatsink is not only effective but also versatile in its use. It can be employed in various fields and electronic devices, making it a favorite among engineers and hobbyists alike. Some common applications include:

1. Computer Systems

In desktops and laptops, the ATS-55300W-C1-R0 can be integrated into processors and graphics cards to manage heat efficiently, ensuring optimal performance during demanding tasks.

2. Telecommunications Equipment

Devices such as routers and servers often require efficient thermal management. The ATS-55300W-C1-R0 is perfect for use in these high-performance applications.

3. Consumer Electronics

From gaming consoles to televisions, the need for effective cooling solutions is critical in ensuring reliability and performance. The ATS-55300W-C1-R0 provides an excellent solution for various consumer electronic devices.

Installation Tips for the ATS-55300W-C1-R0 Heatsink

To maximize the efficiency and benefits of the ATS-55300W-C1-R0 heatsink, proper installation is critical. Here are some tips to ensure a successful setup:

  • Clean Surface: Ensure that the surface of the component is clean and free from dust or any other obstructions before applying the heatsink.
  • Thermal Interface Material: Use a suitable thermal paste or pad as a thermal interface material to enhance heat transfer between the component and the heatsink.
  • Secure Mounting: Use appropriate mounting mechanisms provided to secure the heatsink firmly to avoid dislodgement during operation.
  • Monitor Temperatures: After installation, keep an eye on the temperatures to ensure that the heatsink is performing as expected.

Final Thoughts on the ATS-55300W-C1-R0 Heatsink

In summary, the ATS-55300W-C1-R0 heatsink stands out as a top-quality thermal management solution, ideally suited for various applications that require effective heat dissipation. Its premium extruded aluminum, sleek design, and compatibility with BGA configurations make it an indispensable component in maintaining the performance and reliability of electronic devices. Choose the ATS-55300W-C1-R0 heatsink today and ensure that your devices operate at their best while avoiding overheating issues!

Explore more about essential heatsink options to enhance your thermal management solutions.

Additional information
Weight 0,01745 kg
Manufacturer

Length

Width

Height

Material

Colour

Application

Heatsink-shape

Type-of-heatsink

Thermal-resistance-200-lfm

Material-finishing

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At Eselcom, we are committed to ensuring your orders are delivered with speed, security, and convenience. Our comprehensive shipping services are designed to provide peace of mind and reliability every step of the way.

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