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ATS-51325K-C1-R0

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This product is a black extruded heatsink designed for BGA applications. It features a grilled surface with dimensions of 32.5mm in length and 32.5mm in width, ensuring effective heat dissipation for enhanced performance in electronic devices.

SKU: 298941745340 Category:
Weight:
20.8g

$19.87

/

pcs

25 in stock

Estimated delivery time: 7-14 days
* Please note that delivery times may vary based on supplier availability and shipping location.

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Description

When it comes to efficient heat dissipation in electronic devices, the ATS-51325K-C1-R0 heatsink stands out as an exceptional choice. Designed specifically for BGA (Ball Grid Array) applications, this heatsink ensures optimal performance and reliability even under extreme conditions.

Product Overview

The ATS-51325K-C1-R0 heatsink is expertly engineered through a process called extrusion, which allows for a uniform and high-quality finish. This heatsink is particularly suitable for various applications that generate significant thermal output. Its dimensions, measuring 32.5mm in both length and width, make the ATS-51325K-C1-R0 an ideal fit for numerous BGA package types.

Key Features

  • Material: Constructed from high-grade aluminum, the ATS-51325K-C1-R0 heatsink provides excellent thermal conductivity.
  • Design: The grilled design of the heatsink maximizes airflow, ensuring efficient heat dissipation from the semiconductor devices it cools.
  • Color: Available in a sleek black finish, this product complements modern electronic designs while enhancing thermal management.
  • Performance: Optimized for both passive and active cooling solutions, making it versatile for various applications.

Why Choose the ATS-51325K-C1-R0 Heatsink?

If you are looking for enhanced performance and reliability in your thermal management solutions, the ATS-51325K-C1-R0 heatsink is your best bet. With its extruded aluminum structure, it offers several benefits:

1. Excellent Thermal Performance

The primary function of any heatsink is to dissipate heat, and the ATS-51325K-C1-R0 does this with precision. The extruded design maximizes surface area, permitting effective heat transfer away from the components it serves. The grill pattern further aids in increasing airflow, ensuring that even the hottest components remain cool under intensive workloads.

2. Durability and Reliability

Durability is critical in any electronic component, and the ATS-51325K-C1-R0 does not disappoint. Using high-quality aluminum means this heatsink is resistant to oxidation and corrosion, ensuring a long lifespan even in challenging environments.

3. Versatile Applications

This heatsink is not restricted to a single application. Its dimensions and design make the ATS-51325K-C1-R0 suitable for a wide range of electronic devices, including:

  • Computers and laptops
  • Consumer electronics, such as gaming consoles
  • Telecommunication equipment
  • LED lighting systems
  • Power amplifiers and converters

Installation Guidelines

Installing the ATS-51325K-C1-R0 heatsink is straightforward, but following proper installation guidelines is essential for optimal performance:

  • Ensure the surface of the chip is clean and free of dust or debris.
  • Use a thermal interface material (TIM) to improve thermal conductivity between the heatsink and the component.
  • Align the heatsink correctly over the BGA substrate and secure it using appropriate mounting hardware.
  • Check for any obstructions to airflow around the heatsink after installation.

Frequently Asked Questions

What is a BGA heatsink?

A BGA heatsink is designed specifically for cooling Ball Grid Array packages, which are commonly used for high-performance integrated circuits. The ATS-51325K-C1-R0 is tailored to accommodate the unique thermal and physical requirements of such components.

How does the grilled design benefit performance?

The grilled design of the ATS-51325K-C1-R0 heatsink allows for better airflow compared to solid designs. This helps to dissipate heat more efficiently, thereby maintaining optimal thermal conditions for the components.

Is the ATS-51325K-C1-R0 compatible with active cooling systems?

Yes, the ATS-51325K-C1-R0 is an excellent passive cooling solution and can also be integrated with active cooling systems, such as fans, to enhance thermal management even further.

Conclusion

In summary, the ATS-51325K-C1-R0 heatsink provides an effective, durable, and versatile solution for thermal management in various electronics. With its expertly designed extruded aluminum structure and a stylish black finish, it not only enhances the performance but also the aesthetic appeal of your electronic projects. If you are in the market for a reliable heatsink tailored for BGA applications, look no further than the ATS-51325K-C1-R0. Experience superior performance and dependability with this outstanding heatsink today!

For more options and accessories for your cooling needs, check out our heatsinks category.

Additional information
Weight 0.0208 kg
Manufacturer

Type-of-heatsink

Heatsink-shape

Application

Colour

Length

Width

Height

Material

Material-finishing

Thermal-resistance-200-lfm

Manufacturer-series

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