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ATS-51310D-C1-R0

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This black extruded heatsink features a grilled design and is specifically made for BGA applications. Its dimensions are 31mm in length, 31mm in width, and 9.5mm in height, making it an efficient cooling solution for various electronic components.

SKU: 298941749502 Category:
Weight:
15.62g

18,07 

/

pcs

25 in stock

Estimated delivery time: 7-14 days
* Please note that delivery times may vary based on supplier availability and shipping location.

Quantity FromPrice Per Item
1$15.06
2$13.60
4$12.85
25$12.53

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25 in stock

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Description

Welcome to the ultimate solution for enhancing thermal management in your electronic devices – the ATS-51310D-C1-R0 heatsink. This intricately designed heatsink is crafted to ensure optimal performance, making it an essential component for various applications, particularly those utilizing Ball Grid Array (BGA) packages.

Understanding the ATS-51310D-C1-R0 Heatsink

The ATS-51310D-C1-R0 heatsink features a unique extruded design that maximizes airflow and provides superior heat dissipation. Its sleek black finish not only adds to its aesthetic appeal but also promotes efficient thermal performance. With dimensions of 31mm in length, 31mm in width, and a height of 9.5mm, this heatsink is versatile and compact, making it an ideal choice for a variety of electronic applications.

Key Features of the ATS-51310D-C1-R0 Heatsink

  • Material: Constructed from high-quality extruded aluminum, providing excellent thermal conductivity.
  • Design: The grilled structure enhances surface area, promoting better airflow for efficient heat dispersion.
  • Compatibility: Ideal for use on BGA packages, ensuring a perfect fit for your electronic components.
  • Color: Black finish, which aids in heat radiation while offering a sleek look for modern electronic devices.
  • Dimensions: Compact size (L: 31mm, W: 31mm, H: 9.5mm) allows for versatile integration into various setups.

The Importance of Thermal Management

Effective thermal management is crucial in preventing overheating, which can lead to malfunction or failure of electronic components. The ATS-51310D-C1-R0 is designed to tackle this problem head-on. Its extruded structure combined with a grilled surface allows it to dissipate heat efficiently, thereby enhancing the lifespan and reliability of your electronic devices.

Why Choose the ATS-51310D-C1-R0 Heatsink?

  • Enhanced Performance: By efficiently dissipating heat, the ATS-51310D-C1-R0 ensures your devices operate at optimal temperatures.
  • Reduced Risk of Failure: Proper thermal management can prevent overheating, thus mitigating risks associated with component failure.
  • Easy Installation: The compact design of the ATS-51310D-C1-R0 allows for hassle-free installation in various electronics.
  • Cost-Effective Solution: Investing in the ATS-51310D-C1-R0 can save costs in repairs and replacements caused by overheating issues.

Applications of the ATS-51310D-C1-R0 Heatsink

The versatility of the ATS-51310D-C1-R0 heatsink makes it suitable for a wide range of applications. Here are a few areas where this heatsink can be utilized:

  • Consumer Electronics: In devices such as laptops, game consoles, and handheld gadgets where overheating can negatively affect performance.
  • Telecommunications: Essential for equipment like routers and switches that undergo high processing loads and heat generation.
  • Industrial Electronics: Provides a reliable solution for machinery control systems, sensors, and automation equipment.
  • Medical Devices: Ensures that sensitive medical equipment operates safely and efficiently without overheating.

Installation Tips for the ATS-51310D-C1-R0 Heatsink

Installing the ATS-51310D-C1-R0 heatsink correctly is vital for ensuring optimal performance. Here are some tips to facilitate a smooth installation:

  • Prepare the Surface: Ensure the surface of the BGA package is clean and free from dust or contaminants.
  • Use Thermal Interface Material: Apply a thin layer of thermal paste or pad between the heatsink and the BGA to improve heat transfer.
  • Secure the Heatsink: Ensure that the heatsink is properly secured to the BGA to prevent any movement during operation.
  • Check Airflow: Ensure that there is adequate airflow around the heatsink to promote efficient heat dissipation.

Conclusion

In summary, the ATS-51310D-C1-R0 heatsink is a reliable and efficient solution for managing heat in various electronic applications. Its extruded, grilled design enhances airflow, while its compact dimensions provide versatility in installation. Whether you’re working with consumer electronics, industrial machinery, telecommunications equipment, or medical devices, the ATS-51310D-C1-R0 is an invaluable tool to keep your components running smoothly and effectively. Invest in quality thermal management today with the ATS-51310D-C1-R0 and experience the difference it makes in your device’s performance! For more information about thermal management solutions, visit our heatsinks category page.

Additional information
Weight 0,01562 kg
Manufacturer

Type-of-heatsink

Heatsink-shape

Application

Colour

Length

Width

Height

Material

Material-finishing

Thermal-resistance-200-lfm

Manufacturer-series

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