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ATS-51170D-C1-R0

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This product is a black extruded heatsink designed for BGA applications, measuring 17mm in length, 17mm in width, and 9.5mm in height. Its grilled structure enhances airflow and cooling efficiency, making it suitable for various electronic devices.

SKU: 298941704593 Category:
Weight:
6g

16,24 

/

pcs

24 in stock

Estimated delivery time: 7-14 days
* Please note that delivery times may vary based on supplier availability and shipping location.

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Description

When it comes to optimal thermal management in electronic devices, selecting the right heatsink is crucial. The ATS-51170D-C1-R0 heatsink is designed to offer superior performance for a variety of applications, particularly in environments where efficient heat dissipation is vital. Here’s a detailed overview of the ATS-51170D-C1-R0 heatsink, its specifications, and why it is an excellent choice for your thermal management needs.

Overview of the ATS-51170D-C1-R0 Heatsink

The ATS-51170D-C1-R0 is an extruded, grilled heatsink specifically engineered for Ball Grid Array (BGA) components. Constructed from durable black aluminum, this heatsink measures 17mm in length, 17mm in width, and 9.5mm in height, making it an ideal solution for compact electronics that require effective cooling. Its design ensures that heat generated by electronic components is dissipated efficiently, enhancing reliability and longevity.

Key Features of ATS-51170D-C1-R0

  • Extruded Construction: The robust structure of the extruded design ensures durability under various environmental conditions.
  • Grilled Surface: The unique grilled geometry optimizes airflow, allowing for maximum heat dissipation, crucial for maintaining safe operating temperatures.
  • Compatibility with BGA: The ATS-51170D-C1-R0 is specifically designed for BGA applications, making it an excellent choice for modern electronic devices.
  • Compact Size: At 17mm x 17mm x 9.5mm, the ATS-51170D-C1-R0 fits perfectly in space-constrained environments, minimizing impact on overall design.
  • Stylish Black Finish: The black anodized coating not only enhances aesthetics but also provides improved protection against oxidation, boosting reliability in varying conditions.

Specifications of ATS-51170D-C1-R0

The detailed specifications of the ATS-51170D-C1-R0 heatsink make it an attractive option for engineers and designers alike:

  • Length: 17mm
  • Width: 17mm
  • Height: 9.5mm
  • Material: Aluminum
  • Color: Black
  • Type: Extruded, grilled BGA heatsink

Why Choose the ATS-51170D-C1-R0 Heatsink?

Choosing the right heatsink can significantly impact your device’s performance. Here are several reasons why the ATS-51170D-C1-R0 is a superior choice:

1. Enhanced Thermal Performance

The primary function of any heatsink is to provide effective heat dissipation. The ATS-51170D-C1-R0 achieves this through its grilled design, optimizing surface area and enabling better airflow. This is particularly crucial in high-performance applications where excess heat threatens component longevity.

2. Reliability in Compact Designs

Its compact dimensions allow the ATS-51170D-C1-R0 to seamlessly fit into small electronic devices, supporting densely packed electronic circuits without sacrificing cooling efficiency.

3. Versatile Applications

The ATS-51170D-C1-R0 heatsink is versatile, suitable for diverse applications from consumer electronics to industrial equipment. It excels in devices that use BGA packages, making it a prime option for next-generation technology.

4. Aesthetic Appeal

The sleek black finish of the ATS-51170D-C1-R0 not only protects against oxidation but also ensures it integrates seamlessly with modern electronic designs. Its visual appeal is a bonus for designers prioritizing aesthetics alongside functionality.

Installation Tips for the ATS-51170D-C1-R0 Heatsink

Proper installation is key to maximizing the performance of your ATS-51170D-C1-R0 heatsink. Here are some tips:

  1. Surface Preparation: Ensure that the surface of the BGA component is clean and free from debris or old thermal paste.
  2. Thermal Interface Material: Apply a thin layer of high-quality thermal interface material (TIM) to enhance thermal conductivity between the BGA and the heatsink.
  3. Secure Attachment: Use an appropriate method to secure the heatsink effectively, ensuring full contact without excessive pressure.
  4. Testing: After installation, monitor the temperature under load to ensure proper functioning of the heatsink.

Conclusion

The ATS-51170D-C1-R0 heatsink is an outstanding solution for efficient heat management in compact electronic designs. With its expertly crafted features and reliable performance, it’s an investment worth making for engineers and designers focused on quality and effectiveness. If you’re looking to enhance the performance and reliability of your electronic products, consider integrating the ATS-51170D-C1-R0 into your thermal management strategy today. For more heatsink options and accessories, visit our heatsink category page.

Additional information
Weight 0,006 kg
Manufacturer

Type-of-heatsink

Heatsink-shape

Application

Colour

Length

Width

Height

Material

Material-finishing

Thermal-resistance-200-lfm

Manufacturer-series

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