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AS4C64M16D2A-25BIN

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The IC is a 1Gb DRAM memory module featuring a 64Mx16bit configuration. It operates at 1.8V with a speed of 400MHz and a cycle time of 12.5ns. The package type is FBGA84, making it suitable for various electronic applications.

SKU: 298938838426 Category:
Weight:
0.19g

$8.70

/

pcs

89 in stock

Estimated delivery time: 7-14 days
* Please note that delivery times may vary based on supplier availability and shipping location.

Quantity FromPrice Per Item
1$7.25
3$5.24
8$4.96
100$4.82
209$4.78

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89 in stock

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Packing Information:
  • Packing Detail: TR1, ST, , 209
Description

The AS4C64M16D2A-25BIN is a high-performance DRAM memory chip designed for a wide range of electronic applications. This versatile Integrated Circuit (IC) boasts a capacity of 1 Gigabit (Gb) and features 64 Megabytes (Mx) of 16-bit data width, making it ideal for consumers looking to enhance the speed and efficiency of their devices.

Technical Specifications of the AS4C64M16D2A-25BIN

The AS4C64M16D2A-25BIN comes packed with impressive specifications that cater to the demands of modern electronics:

  • Memory Type: DRAM
  • Capacity: 1Gb (1 Gigabit)
  • Organization: 64Mx16bits
  • Voltage: 1.8 Volts
  • Frequency: 400 MHz
  • Access Time: 12.5 ns
  • Package Type: FBGA84

Features and Benefits

The AS4C64M16D2A-25BIN offers a number of features that highlight its suitability for various applications, ensuring manufacturers can meet consumer needs effectively. Below are some of the standout features:

High Speed Performance

Operating at a frequency of 400 MHz, the AS4C64M16D2A-25BIN ensures that data can be accessed and retrieved quickly. With an access time of just 12.5 nanoseconds, the chip provides swift data performance crucial for high-speed processing.

Low Voltage Operation

Designed to operate efficiently at a voltage of only 1.8V, the AS4C64M16D2A-25BIN offers reduced power consumption compared to other memory options. This not only helps in conserving battery life for portable devices but also reduces heat generation, extending the lifespan of the device.

Compact Package Design

The chip is packaged in a FBGA84 (Fine Ball Grid Array) format, contributing to its compact design. Its size allows for a simpler layout in PCB designs, making it easier for manufacturers to integrate the IC into smaller devices without sacrificing performance.

Applications for the AS4C64M16D2A-25BIN

The AS4C64M16D2A-25BIN is designed for a variety of applications within consumer electronics. Here are some common uses:

  • Smartphones and Tablets: Perfect for mobile devices that require quick access to data.
  • Computers and Laptops: Used in memory modules to provide improved speed and performance.
  • Embedded Systems: Ideal for devices where space is limited but performance cannot be compromised.
  • Gaming Consoles: Offers high-speed data retrieval vital for an immersive gaming experience.

Why Choose the AS4C64M16D2A-25BIN?

When selecting memory solutions, the AS4C64M16D2A-25BIN stands out as a top choice due to its robust specifications and adaptability. Here are several reasons why this DRAM chip is an excellent investment:

  • Reliable Performance: This chip is engineered to provide consistent and reliable performance, essential for critical applications.
  • Cost-effective Solution: Given its capabilities, the AS4C64M16D2A-25BIN offers great value for manufacturers looking to enhance their products without compromising on quality.
  • Flexibility: With vast application possibilities, this memory chip can seamlessly fit in numerous devices across different sectors.
  • Long-term Availability: As a widely-used DRAM solution, manufacturers can expect ongoing support and continuous availability of components for the years to come.

Conclusion

The AS4C64M16D2A-25BIN DRAM memory chip demonstrates a combination of high performance, low power consumption, and versatility, making it an essential component for a variety of electronic devices. With specifications that meet the high demands of today’s technology landscape, this chip is perfect for manufacturers aiming to deliver exceptional products. Choose the AS4C64M16D2A-25BIN for reliable, efficient memory solutions that will help power the next generation of electronics. For more semiconductor options, visit our DRAM category page.

Additional information
Weight 0.00019 kg
Manufacturer

Type-of-integrated-circuit

Kind-of-memory

Memory

Memory-organisation

Access-time

Clock-frequency

Case

Kind-of-interface

Mounting

Operating-temperature

Kind-of-package

Operating-voltage

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