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ATS-51250D-C1-R0

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This extruded black heatsink is designed for BGA applications, measuring 25mm in length, 25mm in width, and 9.5mm in height. Its grilled design enhances heat dissipation, making it ideal for effective thermal management in electronic components.

SKU: 298941727355 Category:
Weight:
11g

$17.21

/

pcs

25 in stock

Estimated delivery time: 7-14 days
* Please note that delivery times may vary based on supplier availability and shipping location.

Quantity FromPrice Per Item
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4$12.26
25$12.02

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Packing Information:
  • Packing Detail: CT1, ST, , 25
Description

Introducing the ATS-51250D-C1-R0 Heatsink: Your Optimal Solution for Thermal Management

Welcome to the world of innovative thermal management solutions with the ATS-51250D-C1-R0 heatsink. This heatsink is specifically designed for high-performance electronics, making it the essential choice for reliable cooling in various applications. In this article, we will delve into the specifications, advantages, and potential applications of the ATS-51250D-C1-R0, elevating your understanding and appreciation for effective heat dissipation technology.

Specifications of the ATS-51250D-C1-R0

The ATS-51250D-C1-R0 is an extruded aluminum heatsink that combines performance with aesthetic appeal. Below are its specifications:

  • Material: Extruded aluminum
  • Type: Grilled, BGA (Ball Grid Array) compatible
  • Color: Sleek black finish
  • Dimensions:
    • Length: 25mm
    • Width: 25mm
    • Height: 9.5mm

Why Choose the ATS-51250D-C1-R0 Heatsink?

The ATS-51250D-C1-R0 heatsink stands out for several key reasons that boost its durability and cooling efficiency. Here’s why it should be part of your thermal management toolkit:

Efficient Thermal Dissipation

The main role of any heatsink is to dissipate heat effectively, and the ATS-51250D-C1-R0 excels in this function. Its extruded design maximizes surface area, ensuring maximum heat transfer away from sensitive electronic components. This helps your devices operate at optimal temperatures, thereby reducing the risk of performance issues caused by overheating.

Versatile Compatibility

The ATS-51250D-C1-R0 is tailored for use with BGA packages, making it suitable for a wide array of applications in microelectronics and semiconductor devices. Its compact dimensions (25mm x 25mm x 9.5mm) allow for easy integration into complex circuit designs, ensuring performance remains uncompromised.

Durable and Aesthetic Design

Made from high-quality extruded aluminum and finished in sleek black, the ATS-51250D-C1-R0 not only delivers superior performance but also enhances the visual appeal of your electronic projects. This dual functionality caters to both practical and aesthetic needs.

Applications of the ATS-51250D-C1-R0

The versatility of the ATS-51250D-C1-R0 makes it suitable for a multitude of applications. Here are a few potential uses:

  • Consumer Electronics: Perfect for televisions, gaming consoles, and personal computing devices where effective heat management is crucial.
  • Embedded Systems: Ideal for microcontrollers and processors requiring efficient thermal management to maintain reliability and performance.
  • LED Lighting: This heatsink can be utilized in LED lighting systems to manage thermal output, ensuring longevity and consistent performance.
  • Telecommunications: Suitable for both mobile and stationary telecom equipment where high temperatures can affect signal quality and device longevity.

Installation Process of the ATS-51250D-C1-R0

Installing the ATS-51250D-C1-R0 heatsink is a straightforward process, allowing for easy implementation into your designs. Here’s a brief overview of the installation process:

  1. Prepare the Surface: Clean the PCB surface where the heatsink will be attached to ensure optimal thermal conductivity.
  2. Apply Thermal Interface Material: Use thermal paste or a thermal pad to enhance contact between the heatsink and the component.
  3. Attach the Heatsink: Position the ATS-51250D-C1-R0 over the component and apply the necessary pressure for a secure fit.
  4. Secure in Place: Depending on your design, utilize clips or screws to firmly secure the heatsink, ensuring stability during operation.

Conclusion: Optimize Your Cooling Needs with the ATS-51250D-C1-R0

In conclusion, the ATS-51250D-C1-R0 is a highly effective and visually appealing heatsink designed to meet the rigorous cooling demands of modern electronics. Whether you’re working on consumer electronics, embedded systems, or any application where heat management is vital, the ATS-51250D-C1-R0 delivers the performance and reliability necessary for success.

Invest in the ATS-51250D-C1-R0 to keep your devices cool and operational, extending their lifespan while enhancing overall performance. Now is the time to switch to superior thermal management with the ATS-51250D-C1-R0. For more semiconductor accessories including heatsinks, visit our Heatsinks category page.

Additional information
Weight 0.011 kg
Manufacturer

Type-of-heatsink

Heatsink-shape

Application

Colour

Length

Width

Height

Material

Material-finishing

Thermal-resistance-200-lfm

Manufacturer-series

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