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ATS-50325B-C1-R0

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This blue extruded heatsink features a grilled design, suitable for BGA applications. It measures 32.5mm in length, 32.5mm in width, and 7.5mm in height, providing efficient heat dissipation for various electronic components.

SKU: 298941654358 Category:
Weight:
17.1g

$17.35

/

pcs

25 in stock

Estimated delivery time: 7-14 days
* Please note that delivery times may vary based on supplier availability and shipping location.

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Description

When it comes to thermal management in electronic devices, choosing the right heatsink is crucial for maintaining optimal performance and longevity. The ATS-50325B-C1-R0 is a highly efficient heatsink specifically designed to meet the demanding cooling needs of BGA (Ball Grid Array) applications. This product features a robust extruded aluminum design, ensuring excellent thermal conductivity and durability.

Key Features of the ATS-50325B-C1-R0

The ATS-50325B-C1-R0 heatsink boasts a variety of features that make it a standout choice for engineers and technicians alike. Below are some key highlights:

  • Dimensions: Measuring 32.5mm in length, 32.5mm in width, and 7.5mm in height, this heatsink is compact yet powerful, making it ideal for space-constrained applications.
  • Material: Made from high-quality extruded aluminum, the ATS-50325B-C1-R0 is not only lightweight but also resistant to corrosion and oxidation, ensuring long-lasting performance.
  • Color: This heatsink features a visually appealing blue finish, enhancing its aesthetic appeal while providing effective functionality.
  • Design: Its grilled design improves airflow and enhances heat dissipation, maximizing cooling efficiency in critical applications.

Why Choose the ATS-50325B-C1-R0?

Choosing the right heatsink can significantly influence your electronic projects. Here’s why the ATS-50325B-C1-R0 is a superior choice:

Efficient Thermal Performance

Heat management is paramount in electronic components, especially in BGA designs where multiple pins generate significant heat. The ATS-50325B-C1-R0 is engineered to provide outstanding thermal performance, ensuring that your devices operate within safe temperature ranges. This not only increases lifespan but also enhances reliability.

Perfect for Space-Constrained Applications

Many modern electronic projects are becoming smaller, making space a premium. The compact dimensions of the ATS-50325B-C1-R0 allow for easy integration into tight spaces without compromising performance. It’s an excellent choice for various applications, including:

  • Consumer electronics
  • Computing hardware
  • Embedded systems
  • Telecommunications devices

Easy Installation

The design of the ATS-50325B-C1-R0 promotes not just efficiency but also ease of installation. Its compatibility with various BGA packages and simple mounting mechanism means less time spent on setup and more focus on your projects.

Applications of the ATS-50325B-C1-R0

The versatility of the ATS-50325B-C1-R0 allows it to be used across a wide range of applications. Some of these include:

  • Consumer Electronics: Ideal for devices such as smartphones, tablets, and laptops that require effective heat dissipation in a compact form.
  • Industrial Automation: Perfect for PLCs (Programmable Logic Controllers) and other control systems requiring reliable thermal management in harsh conditions.
  • Networking Equipment: Suitable for routers, switches, and other networking devices where overheating can lead to performance issues.
  • Automotive Electronics: A top choice for vehicular applications where heat management is critical for components like sensors and control modules.

Technical Specifications

To provide a clearer understanding of the ATS-50325B-C1-R0, here are its detailed technical specifications:

  • Type: Extruded Aluminum Heatsink
  • Dimensions: L: 32.5mm, W: 32.5mm, H: 7.5mm
  • Color: Blue
  • Cooling Method: Passive
  • Weight: Lightweight, enhancing portability.
  • Mounting Options: Equipped with multiple mounting configurations for various applications.

Conclusion

In summary, the ATS-50325B-C1-R0 is an exceptional solution for efficient thermal management in BGA applications. Its thoughtful design, durable construction, and ease of installation offer significant benefits for a wide array of electronic applications. Whether you’re working in consumer electronics, industrial automation, networking, or automotive sectors, the ATS-50325B-C1-R0 is a versatile heatsink that exceeds expectations. Invest in quality thermal management today and ensure your devices run cooler, perform better, and last longer!

For all your thermal management needs, trust the ATS-50325B-C1-R0. With its comprehensive features and reliable performance, it’s the heatsink you can depend on in today’s technology-driven world. Explore more options in our heatsinks category to find the perfect match for your projects.

Additional information
Weight 0.0171 kg
Manufacturer

Type-of-heatsink

Heatsink-shape

Application

Colour

Length

Width

Height

Material

Material-finishing

Thermal-resistance-200-lfm

Manufacturer-series

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Shipping & Delivery

At Eselcom, we are committed to ensuring your orders are delivered with speed, security, and convenience. Our comprehensive shipping services are designed to provide peace of mind and reliability every step of the way.

  • Fast and Flexible Options: We offer various shipping speeds to accommodate your schedule, including express delivery for time-sensitive orders.
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  • Global Reach: With trusted logistics partners, we deliver to customers worldwide, making sure your components arrive safely and on time.
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