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ATS-1041-C3-R0

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This green extruded BGA heatsink measures 41mm in length, 45mm in width, and 10mm in height. Its grilled design enhances airflow and cooling efficiency, making it suitable for various electronic applications.

SKU: 298941225300 Category:
Weight:
25.6g

$19.43

/

pcs

12 in stock

Estimated delivery time: 7-14 days
* Please note that delivery times may vary based on supplier availability and shipping location.

Quantity FromPrice Per Item
1$16.19
2$14.72
3$13.92
25$13.36

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12 in stock

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Description

Introduction to the ATS-1041-C3-R0 Heatsink

In the realm of thermal management solutions, the ATS-1041-C3-R0 heatsink stands out for its superior performance and reliable design. Whether you’re working on electronics that require optimum cooling or are in search of a dependable heatsink for your latest project, the ATS-1041-C3-R0 is engineered to address your thermal needs efficiently. With dimensions of L: 41mm, W: 45mm, and H: 10mm, this heatsink fits seamlessly into various applications, from consumer electronics to high-performance computing.

Key Features of the ATS-1041-C3-R0 Heatsink

Understanding the features of the ATS-1041-C3-R0 heatsink can help you appreciate its utility in various settings. Below are its notable characteristics:

  • Material and Construction: The ATS-1041-C3-R0 is extruded from lightweight yet durable materials, ensuring maximum thermal conductivity without compromising strength.
  • Grilled Design: The grilled texture of the heatsink not only enhances its aesthetics but also optimizes heat dissipation, allowing your components to stay cool under high loads.
  • Size Specifications: With dimensions of L: 41mm, W: 45mm, and H: 10mm, this heatsink fits neatly into compact spaces, making it ideal for various electronic devices.
  • BGA Compatibility: Specifically designed to accommodate Ball Grid Array (BGA) configurations, the ATS-1041-C3-R0 integrates smoothly into your existing designs.
  • Color Finish: The sleek green finish contributes to its professional aesthetic while providing additional protection against environmental factors.

Applications of the ATS-1041-C3-R0 Heatsink

The ATS-1041-C3-R0 heatsink is versatile and can be applied in numerous settings. Here are some of the common applications:

  • Consumer Electronics: Ideal for devices that generate substantial heat, such as smartphones, tablets, and laptops.
  • High-Performance Computing: Perfect for CPUs and GPUs where effective heat dissipation is crucial for performance stability.
  • Telecommunications Equipment: Suitable for various electronic devices used in telecommunications that require robust thermal management.
  • Industrial Applications: Implement the ATS-1041-C3-R0 in machinery and equipment that operate under high thermal loads.

Benefits of Choosing the ATS-1041-C3-R0 Heatsink

There are numerous advantages to using the ATS-1041-C3-R0 heatsink for your thermal management needs:

  • Enhanced Thermal Performance: Designed for optimal heat dissipation, it helps maintain consistent operating temperatures and enhances the longevity of electronic components.
  • Compact Design: The dimensions of the ATS-1041-C3-R0 make it suitable for both small and large-scale applications, fitting comfortably in tight spaces.
  • Cost-Effective Solution: Investing in the ATS-1041-C3-R0 heatsink can save you money in the long run by reducing potential thermal-related failures and maintaining optimal performance.
  • Easy Integration: The compatibility with BGA technology makes it simple to incorporate the ATS-1041-C3-R0 into existing designs with minimal adjustments.

Installation Guidelines for the ATS-1041-C3-R0 Heatsink

Installing the ATS-1041-C3-R0 heatsink is straightforward, but proper guidelines must be followed to ensure optimal performance:

  1. Surface Preparation: Ensure the surfaces of both the heatsink and the component are clean and free from debris.
  2. Application of Thermal Interface Material: Apply a thermal interface material, such as thermal paste, to enhance heat transfer between the component and the heatsink.
  3. Secure the Heatsink: Position the ATS-1041-C3-R0 over the component and secure it using mounting hardware appropriate for your application.
  4. Final Inspection: Check for any movement and ensure that the heatsink is firmly in place, ready to manage heat effectively.

Conclusion

In summary, the ATS-1041-C3-R0 heatsink offers an exceptional solution for those seeking efficient thermal management across a wide range of applications. Its unique design, combined with compatibility for BGA components, makes it a reliable choice for ensuring your electronics operate smoothly under various thermal conditions. Whether you’re designing a new product or upgrading an existing one, consider the ATS-1041-C3-R0 heatsink as an essential component to keep your devices functioning optimally.

Discover the benefits that the ATS-1041-C3-R0 heatsink can bring to your projects by investing in quality thermal management today! For more options and models, visit our heatsinks category.

Additional information
Weight 0.0256 kg
Manufacturer

Length

Width

Height

Material

Colour

Application

Manufacturer-series

Material-finishing

Heatsink-shape

Type-of-heatsink

Thermal-resistance-200-lfm

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